A new Report by Delvens, titled "Low Dielectric Materials Market” offers a comprehensive analysis of the industry, which comprises insights on the Global analysis. The report also includes competitor and regional analysis, and contemporary advancements in the market, the global Low Dielectric Materials Market size is projected to reach a CAGR of 6.7% from 2023-2030.
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Asia Pacific to Dominate the Market
· APAC is the most significant and fastest-growing low dielectric materials market due to the increasing demand for these materials in manufacturing electronic components such as PCBs and microelectronics.
· Furthermore, the increase in air traffic have expanded the demand for antenna and radomes in the region, further driving the demand for low dielectric materials to newer heights.
The prominent players in Low Dielectric Materials Market are
· Arkema
· Arxada
· Asahi Kasei
· Celanese Corporation
· Chenguang Research Institute of Chemical Industry
· Circuit Components Supplies Ltd
· Daikin Industries Ltd
· DIC Corporation
· Dow
· Fluorocarbon and More
A dielectric material is a poor conductor of electricity but an efficient supporter of electrostatic fields. It can store electrical charges and have a high specific resistance and a negative temperature coefficient of resistance. Low-κ dielectric materials are those that have a low dielectric coefficient and are less likely to break down when subjected to higher electric fields.
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This leads to low dielectric materials also known as low-k materials being utilized to continue scaling microelectronic devices, colloquially referred to as extending Moore's law. As components have scaled and transistors have gotten closer together, the insulating dielectrics have thinned to the point where charge build-up and crosstalk adversely affect the performance of the device. Replacing the silicon dioxide with a low-κ dielectric of the same thickness reduces parasitic capacitance, enabling faster switching speeds (in the case of synchronous circuits) and lower heat dissipation.
The various factors propelling the growth of the market are the Development of 5G Communication, the Increase in Delivery of Airplanes and Automobile Production, the Increasing Use of Engineering Resin Substitutes for Ultra-Thin Components, and the Use of Low-Dielectric-Constant Materials for High-Speed Communication Networks.
Recent Developments
In November 2021, Arkema designed 3 new ultra-low loss materials for RF applications, PRO14729, PRO14730 and PRO14731. These new materials were developed to cater the increasing demand for very low dielectric constant and low dissipation factor materials in advanced electronic applications.
In February 2021, Zeon Corporation launched a new form of cyclic olefin copolymer with stereoregular characteristics with unprecedented heat, chemical and bending resistances. The new product is expected to cater the demands from local electronic component manufacturers in Asia Pacific.
The automobile industry's sustained growth has paved the way for breakthroughs in in-car infotainment and autonomous vehicles, which has significantly increased the demand for packaging materials with higher levels of dependability. Independent car manufacturers require packaging materials with a low dielectric constant to meet the demands for quick responses, high speeds, and minimal delays. Meanwhile, the trend towards commercial aircraft electrification has been on the rise in recent years, which involves replacing hydraulic, mechanical, and pneumatic systems with electrical systems. As a result, the aerospace and automobile industries require more low-dielectric materials, which are expected to contribute to the growth of the global market. The demand for low-dielectric materials is expected to continue to rise as technological advancements in both the automotive and aerospace industries progress.
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In addition to the market data for Low Dielectric Materials Market, Delvens offers client-centric report and customized according to the company’s specific demand and requirement.
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